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WAFER PROCESSING EQUIPMENT AND CLEAN ROOM INVENTORY FOR A RESEARCH BASED IC FABRICATION FACILITY SAMI UR REHMAN (samirehman.blogspot.com) 1 SAMI UR REHMAN Difference between Si wafer processing and compound (III/V) wafer processing Oxidation Silicon has a natural oxide while compound semiconductors do not (deposition required). Compound semiconductor requires epitaxial deposition techniques which are quiet expensive! Stability Most of these compound semiconductors are not stable at high temp
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    WAFER PROCESSING EQUIPMENT AND CLEAN ROOM INVENTORY FOR A RESEARCH BASED IC FABRICATION FACILITY SAMI UR REHMAN1    S   A   M   I   U   R   R   E   H   M   A   N    (   s   a   m   i  -   r   e    h   m   a   n .    b    l   o   g   s   p   o   t .   c   o   m    )  Difference between Si wafer processingand compound (III/V) wafer processing Oxidation  Silicon has a natural oxide while compound semiconductorsdo not (deposition required). Compound semiconductorrequires epitaxial deposition techniques which are quietexpensive! Stability Most of these compound semiconductors are not stable athigh temperatures unlike Si. For Si, one would therefore makeMOSFET kind of structures. 2    S   A   M   I   U   R   R   E   H   M   A   N    (   s   a   m   i  -   r   e    h   m   a   n .    b    l   o   g   s   p   o   t .   c   o   m    )  Lattice Constants The first and principal difference between a Siand a GaAs substrate is the respective latticeconstants. Crystalline materials (thin films) whichwill be deposited on top of such substrates willhave to take this into account. Etching Compound semiconductors like GaAs alsorequires a complex Chlorine based etch processunlike Si (F based etch). Difference between Si wafer processingand compound (III/V) wafer processing 3    S   A   M   I   U   R   R   E   H   M   A   N    (   s   a   m   i  -   r   e    h   m   a   n .    b    l   o   g   s   p   o   t .   c   o   m    )  WHAT IS A CLEAN ROOM? ã A clean-room or clean room is an environment, typicallyused in manufacturing and scientific research, that has a lowlevel of environmental pollutants such as dust,airborne microbes, aerosol particles and chemical vapors(Wikipedia) ã What matters isParticle sizeandparticle number ã The standard is called: FED-STD-209 E ã This standard was cancelled on Nov 2011 ã Standardizing Agency: U.S. General ServicesAdministration (GSA) ã Replaced by ISO 14644-1 4    S   A   M   I   U   R   R   E   H   M   A   N    (   s   a   m   i  -   r   e    h   m   a   n .    b    l   o   g   s   p   o   t .   c   o   m    )
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